- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
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CTS Thermal Management Products |
1,686
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | ||
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|
|
CTS Thermal Management Products |
3,861
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | ||
|
|
Advanced Thermal Solutions Inc. |
211
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 24.5MM
|
- | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | |||
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Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 19X19X24.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) |
