- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
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|
CTS Thermal Management Products |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | ||
|
|
|
CTS Thermal Management Products |
168
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | ||
|
|
Advanced Thermal Solutions Inc. |
148
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 24.5MM
|
- | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | |||
|
|
Advanced Thermal Solutions Inc. |
10
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X24.5MM W/OUT TIM
|
- | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) |
