- Series：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Material Finish：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Material Finish | |
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CTS Thermal Management Products |
168
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK 30X30X12.5MM W/OUT TIM
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maxiFLOW | Square, Angled Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | BGA | 0.492" (12.50mm) | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
10
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 25X25X24.5MM W/OUT TIM
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- | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | BGA | 0.964" (24.50mm) | Black Anodized |
