- Manufacturer：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Discover 18 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
CTS Thermal Management Products |
199
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | - | ||
|
|
|
CTS Thermal Management Products |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | - | ||
|
|
|
Wakefield-Vette |
1,661
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 6.30°C/W | ||
|
|
|
CTS Thermal Management Products |
1,356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
408
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 27X27X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | - | |||
|
|
|
CTS Thermal Management Products |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | - | ||
|
|
|
Wakefield-Vette |
971
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 6.30°C/W | ||
|
|
|
Wakefield-Vette |
406
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | - | ||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | - | |||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | - | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 42.5 X 42.5 X 19.5MM
|
- | Top Mount | Square, Pin Fins | 1.673" (42.49mm) | 1.673" (42.49mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 42.5X42.5X19.5MM NO TIM
|
- | Top Mount | Square, Pin Fins | 1.673" (42.49mm) | 1.673" (42.49mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.768" (19.50mm) | - | - | |||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 6.30°C/W | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 38 X 38 X 12MM
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH SMALL CLIP
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH MEDIUM CLIP
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH TALL CLIP
|
APR | Top Mount | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | - |
