Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
6237BG
Aavid, Thermal Division of Boyd Corporation
7,914
3 days
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MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK .375"TO-220
Rectangular, Fins 0.700" (17.78mm) 0.900" (22.86mm) - Clip TO-220 0.375" (9.52mm) 2.0W @ 50°C 25.00°C/W
2227B
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Cylindrical - - 0.315" (8.00mm) ID, 1.250" (31.75mm) OD Press Fit TO-5 0.400" (10.16mm) 1.8W @ 50°C 21.00°C/W