- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
8,455
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB .25
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0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 32.00°C/W | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.7X12.7MM
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0.500" (12.70mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | - | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 6.4X13.3X19.1MM
|
0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | - |
