- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
5,511
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3 days |
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 .500" COMPACT
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1.880" (47.75mm) | 1.400" (35.56mm) | TO-3 | 0.500" (12.70mm) | 2.0W @ 30°C | 12.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.550" (39.37mm) | 1.040" (26.42mm) | TO-66 | 1.000" (25.40mm) | 4.0W @ 40°C | 8.00°C/W |
