Discover 5 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise
628-40AB
Wakefield-Vette
562
3 days
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MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.4"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.400" (10.16mm) 2.5W @ 30°C
825902B05300
Comair Rotron
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK STAMP 24.1X48.3X23.6
- Board Level, Vertical Rectangular, Fins 0.930" (23.62mm) 1.900" (48.26mm) Bolt On and PC Pin TO-220 0.950" (24.13mm) 2.0W @ 20°C
826002B05300
Comair Rotron
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK STAMP 9.7X44.5X36.8MM
- Board Level, Vertical Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) Bolt On and PC Pin TO-220 0.380" (9.65mm) 3.0W @ 30°C
824302B00000
Comair Rotron
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK STAMP 36.8X44.5X9.4MM
- Board Level Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) Bolt On TO-220 0.370" (9.40mm) 4.0W @ 40°C
822812B00000
Comair Rotron
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK STAMP 17.8X44.5X12.7MM
- Board Level Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) Bolt On TO-220 0.500" (12.70mm) 10.0W @ 70°C