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Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
6,523
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SNAP-DOWN .75"
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- | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.980" (24.89mm) | Clip | TO-220 | 0.440" (11.18mm) | 3.0W @ 50°C | 16.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
10,100
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SNAP-DOWN .75"
|
- | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.980" (24.89mm) | Clip | TO-220 | 0.440" (11.18mm) | 3.0W @ 50°C | 16.80°C/W | ||
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Wakefield-Vette |
948
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 35MM SQ H=.45" BLK
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642 | Top Mount | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | - | ||
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Ohmite |
84
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-126 25MM
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C | Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | 1.280" (32.51mm) | Clip and PC Pin | TO-126 | 0.732" (18.60mm) | 3.5W @ 28°C | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | Clip | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 20.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 20.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 20.40°C/W | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X19X19MM
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- | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 1.0W @ 30°C | - |
