- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,101
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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Board Level, Vertical | Bolt On and PC Pin | TO-218 | 12.0W @ 50°C | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Bolt On | TO-218 | 6.0W @ 30°C | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Bolt On and PC Pin | TO-218 | 12.0W @ 50°C | 4.50°C/W | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Clip and PC Pin | TO-220 | 6.0W @ 30°C | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Clip and PC Pin | TO-220 (Dual) | 6.0W @ 30°C | 2.70°C/W |
