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Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
821
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 40MM X 40MM X 9.5MM
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maxiGRIP | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
100
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3 days |
-
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MOQ: 1 MPQ: 1
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SUPERGRIP HEATSINK 40X40X7.5MM
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superGRIP | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
17
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 40MM X 40MM X 9.5MM
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- | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | - | Black Anodized | |||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 2.480" (63.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 9.1W @ 75°C | 8.24°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X9.5MM W/OUT TIM
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- | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | - | - | Black Anodized |
