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Discover 94 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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CTS Thermal Management Products |
1,686
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
4,900
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
3,861
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,900
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
3,956
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
199
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
371
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
360
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | Top Mount | Aluminum | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 5.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 3.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
438
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
2,815
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 1.90°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
667
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR W/PINS BLACK TO-220
|
7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 60°C | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
168
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 3.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 1.90°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TRIPLE BLACK TO-220
|
7 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 1.642" (41.70mm) | - | Bolt On | TO-220 | 0.690" (17.53mm) | 3.0W @ 30°C | - | Black Anodized |
