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- Material：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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Discover 3,105 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
Advanced Thermal Solutions Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 8.17°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 54X54X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.126" (54.01mm) | 2.126" (54.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 7.43°C/W @ 100 LFM | Blue Anodized | |||
|
|
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Wakefield-Vette |
993
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 32X32X12MM
|
Wave 3x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | Clip | BGA | 4.64°C/W @ 200 LFM | Black Anodized | ||
|
|
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Wakefield-Vette |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 35X35X12MM
|
Wave 3x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 3.83°C/W @ 200 LFM | Black Anodized | ||
|
|
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Wakefield-Vette |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 40X40X12MM
|
Wave 4x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | Clip | BGA | 3.36°C/W @ 200 LFM | Black Anodized | ||
|
|
|
Wakefield-Vette |
997
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 45X45X12MM
|
Wave 4x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Clip | BGA | 2.96°C/W @ 200 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
976
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.969" (50.00mm) | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 3.90°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 6.39°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
36
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 10.93°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 9.06°C/W @ 100 LFM | Blue Anodized | |||
|
|
|
Wakefield-Vette |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 26X26X12MM
|
Wave 2x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.024" (26.00mm) | 1.024" (26.00mm) | Clip | BGA | 5.21°C/W @ 200 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.969" (50.00mm) | 1.772" (45.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 3.90°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32MM X 50MM X 12MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 1.260" (32.00mm) | 1.969" (50.00mm) | Clip | Flip Chip Processors | 3.80°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32MM X 50MM X 12MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 1.260" (32.00mm) | 1.969" (50.00mm) | Clip | Flip Chip Processors | 3.20°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 5.18°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 10.88°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 9.03°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 8.15°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 54X54X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.126" (54.01mm) | 2.126" (54.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 7.41°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 11.12°C/W @ 100 LFM | Blue Anodized |
