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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
2,632
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Top Mount | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 2.00°C/W @ 400 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 36.8X19.8X21.6MM
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- | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 0.779" (19.80mm) | Bolt On | TO-220 | 0.850" (21.60mm) | 5.00°C/W @ 200 LFM | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 36.8X44.5X9.4MM
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- | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 0.370" (9.40mm) | 4.00°C/W @ 300 LFM |
