- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 2.50°C/W @ 400 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 24.1X48.3X23.6
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Board Level, Vertical | Rectangular, Fins | 0.930" (23.62mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 4.00°C/W @ 300 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 12.7X34.9X50.8MM
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Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.500" (12.70mm) | 4.50°C/W @ 200 LFM |
