- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
2,678
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.3W H=1.0 BLK
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Board Level | 0.640" (16.26mm) | Bolt On | TO-220 | 0.640" (16.26mm) | 4.00°C/W @ 500 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X25.4MM
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Board Level, Vertical | 0.650" (16.51mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 3.00°C/W @ 700 LFM |
