Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow
628-65AB
Wakefield-Vette
4,378
3 days
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MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.650" (16.51mm) 2.00°C/W @ 400 LFM
628-65ABT5
Wakefield-Vette
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.650" (16.51mm) 2.00°C/W @ 400 LFM
825802B05300
Comair Rotron
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK STAMP 24.1X48.3X49.5MM
- Board Level, Vertical Rectangular, Fins 1.950" (49.53mm) 1.900" (48.26mm) Bolt On and PC Pin TO-220 0.950" (24.13mm) 2.50°C/W @ 400 LFM