- Manufacturer:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | ||
Wakefield-Vette |
4,378
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 2.00°C/W @ 400 LFM | ||||
Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 2.00°C/W @ 400 LFM | ||||
Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 24.1X48.3X49.5MM
|
- | Board Level, Vertical | Rectangular, Fins | 1.950" (49.53mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 2.50°C/W @ 400 LFM |