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Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
11,699
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3 days |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.9X15X9.5MM
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Board Level | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.0W @ 40°C | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.997" (25.33mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | Black Anodized |
