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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Wakefield-Vette |
4,845
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | Black Anodized | ||
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Wakefield-Vette |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 13.1X13.2X24MM
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- | Board Level, Vertical | Copper | Rectangular, Fins | 0.848" (21.55mm) | 0.520" (13.21mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 0.5W @ 20°C | Tin |
