- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.7X12.7MM
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0.500" (12.70mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 6.4X13.3X19.1MM
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0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C |
