- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
Discover 2 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 2.0W @ 20°C | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 24.1X48.3X49.5MM
|
Board Level, Vertical | Rectangular, Fins | 1.950" (49.53mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 3.0W @ 20°C |
