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Discover 7,242 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Advanced Thermal Solutions Inc. |
1,207
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 50X50X6MM XCUT CP
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pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | - | 15.83°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
163
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 50X50X25MM XCUT FP
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 7.44°C/W @ 100 LFM | Blue Anodized | |||
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Ohmite |
215
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIPS FOR 2 TO-220
|
C | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | Black Anodized | ||
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Wakefield-Vette |
680
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 18X50MM TO-247 TO-264
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OmniKlip | Board Level, Vertical | Rectangular, Fins | 0.710" (18.03mm) | Clip, Solder Foot | TO-247, TO-264 | 1.500" (38.10mm) | - | - | Black Anodized | ||
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Ohmite |
368
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-247 WITH 2 CLIPS
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C | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 30°C | 5.00°C/W @ 200 LFM | Degreased | ||
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Ohmite |
296
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 2 CLIPS
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C | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 30°C | 5.00°C/W @ 200 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
258
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X10MM XCUT CP
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 9.48°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
118
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 50X50X15MM XCUT CP
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pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 5.87°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
102
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12MM XCUT CP
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pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.472" (12.00mm) | - | 8.17°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
295
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X10MM XCUT FP
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 18.78°C/W @ 100 LFM | Blue Anodized | |||
|
|
|
Ohmite |
175
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR 2 TO-220
|
C | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | Degreased | ||
|
|
Advanced Thermal Solutions Inc. |
170
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12.7MM XCUT T766
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 15.86°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
187
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X15MM XCUT T766
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pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 13.70°C/W @ 100 LFM | Blue Anodized | |||
|
|
|
Wakefield-Vette |
924
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18X50MM 2-CLIP TO-220
|
OmniKlip | Board Level, Vertical | Rectangular, Fins | 0.710" (18.03mm) | Clip, Solder Foot | TO-220 | 1.500" (38.10mm) | - | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
147
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 15MM
|
maxiFLOW | Top Mount | Rectangular, Angled Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.590" (15.00mm) | - | 2.80°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,014
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 15MM
|
maxiFLOW | Top Mount | Rectangular, Angled Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.590" (15.00mm) | - | 2.80°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
976
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 50MM X 45MM X 12.5MM
|
maxiFLOW | Top Mount | Rectangular, Angled Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.472" (12.00mm) | - | 3.90°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
45
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X20MM XCUT CP
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | - | 4.16°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X15MM XCUT FP
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 13.70°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X20MM XCUT FP
|
pushPIN | Top Mount | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | - | 9.97°C/W @ 100 LFM | Blue Anodized |
