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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Copper | 1.000" (25.40mm) | Bolt On and PC Pin | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Aluminum | 0.997" (25.33mm) | Clip and PC Pin | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Aluminum | 1.000" (25.40mm) | Clip and PC Pin | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Anodized | ||
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|
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Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Aluminum | 1.000" (25.40mm) | Bolt On and PC Pin | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | ||
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|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Copper | 1.000" (25.40mm) | Bolt On and PC Pin | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Paint | ||
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|
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Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
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Aluminum | 1.000" (25.40mm) | Bolt On and PC Pin | 2.0W @ 30°C | 5.00°C/W @ 500 LFM | Black Anodized |
