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Discover 19,676 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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CTS Thermal Management Products |
199
|
3 days |
-
|
MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | 3.30°C/W @ 200 LFM | Black Anodized | ||
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|
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CTS Thermal Management Products |
969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | 2.50°C/W @ 200 LFM | Black Anodized | ||
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|
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CTS Thermal Management Products |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | 3.30°C/W @ 200 LFM | Black Anodized | ||
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|
|
CTS Thermal Management Products |
438
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | 2.50°C/W @ 200 LFM | Black Anodized | ||
|
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Advanced Thermal Solutions Inc. |
310
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 19.5MM
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- | Top Mount | Aluminum | Square, Pin Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 3.60°C/W @ 200 LFM | Black Anodized | |||
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|
|
CTS Thermal Management Products |
2,815
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 1.90°C/W @ 200 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
258
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 2.60°C/W @ 200 LFM | Black Anodized | |||
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|
Advanced Thermal Solutions Inc. |
361
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X10MM NYLONPUSHPIN
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.500" (38.10mm) | Push Pin | BGA | 0.394" (10.00mm) | 3.90°C/W @ 300 LFM | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
106
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X25MM PEM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.500" (38.10mm) | Push Pin | BGA | 0.984" (25.00mm) | 1.60°C/W @ 300 LFM | Green Anodized | |||
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t-Global Technology |
4,410
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 40X40X3MM
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XL-25 | Heat Spreader | Ceramic | Square | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.118" (3.00mm) | - | - | ||
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Advanced Thermal Solutions Inc. |
166
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 40X40X6MM XCUT CP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | 21.10°C/W @ 100 LFM | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
298
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X10MM XCUT CP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 11.79°C/W @ 100 LFM | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X15MM XCUT FP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 15.85°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
172
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X25MM XCUT FP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 8.72°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X35MM R-TAB CP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.378" (35.00mm) | 2.80°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
897
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 4.60°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
136
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 3.20°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
254
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X10MM PEM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.500" (38.10mm) | Push Pin | BGA | 0.394" (10.00mm) | 3.90°C/W @ 300 LFM | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
342
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 12.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 2.60°C/W @ 200 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
113
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X15MM PEM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.500" (38.10mm) | Push Pin | BGA | 0.590" (15.00mm) | 2.50°C/W @ 300 LFM | Green Anodized |
