- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
11,604
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB BLACK
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Aluminum | Bolt On and PC Pin | 2.5W @ 60°C | 4.00°C/W @ 700 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
6,869
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB TIN
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Aluminum | Bolt On and PC Pin | 2.5W @ 60°C | 4.00°C/W @ 700 LFM | Tin | ||
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|
Advanced Thermal Solutions Inc. |
1,496
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
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Copper | Bolt On and Board Mounts | - | 8.80°C/W @ 200 LFM | Tin | |||
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Advanced Thermal Solutions Inc. |
1,468
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
|
Copper | Bolt On and Board Mounts | - | 8.80°C/W @ 200 LFM | Tin | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Aluminum | Bolt On and PC Pin | 1.5W @ 40°C | 6.00°C/W @ 400 LFM | Black Anodized |
