Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Discover 4 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
507302B00000G
Aavid, Thermal Division of Boyd Corporation
18,195
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 2.5W LOW PROFILE
0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM
V7235-T
ASSMANN WSW Components
6,080
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 19.05x9.52MM
0.375" (9.52mm) - -
ATS-PCB1009
Advanced Thermal Solutions Inc.
2,568
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 LOW PROFILE
0.375" (9.52mm) - 10.00°C/W @ 200 LFM
ATS-PCB1010
Advanced Thermal Solutions Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK TO-220 HOR MNT LOW PRO
0.375" (9.52mm) - 10.00°C/W @ 200 LFM