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Discover 4 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
ASSMANN WSW Components |
25,551
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM CPU
|
- | Top Mount | Aluminum | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | - | - | Black Anodized | ||||
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM BLACK SMD
|
218 | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.900" (22.86mm) | SMD Pad | SMD | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | Tin | ||||
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM NATURAL SMD
|
218 | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | SMD | 0.400" (10.16mm) | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | Tin | ||||
CTS Thermal Management Products |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
|
7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.250" (31.75mm) | 0.875" (22.22mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 3.0W @ 80°C | - | Black Anodized |