- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
6,015
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1.5"TALL
|
Board Level, Vertical | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | ||
|
|
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ASSMANN WSW Components |
1,136
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level, Vertical | 1.374" (34.90mm) | PC Pin | SOT-32, TO-220, TOP-3 | - | - | ||
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|
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ASSMANN WSW Components |
410
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level, Vertical | 1.378" (35.00mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | ||
|
|
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ASSMANN WSW Components |
293
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level, Vertical | 1.374" (34.90mm) | Bolt On and PC Pin | TO-220 | - | - | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | 1.380" (35.05mm) | Bolt On | TO-218 | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.375" (34.93mm) | Clip and PC Pin | TO-218, TO-247 | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.375" (34.93mm) | Bolt On and PC Pin | TO-218, TO-247 | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.375" (34.93mm) | Clip and PC Pin | TO-220 | 8.0W @ 80°C | 3.00°C/W @ 500 LFM |
