- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
4,893
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 25.4MM
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Board Level, Vertical | 1.550" (39.37mm) | Bolt On and PC Pin | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | ||
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Advanced Thermal Solutions Inc. |
2,596
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLACK
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Board Level | 1.551" (39.40mm) | Bolt On | 0.374" (9.50mm) | - | 6.80°C/W @ 200 LFM | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 1.550" (39.37mm) | Bolt On | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM |
