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- Selected conditions:
Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Aavid, Thermal Division of Boyd Corporation |
7,326
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 DUAL MNT W/TABS
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.480" (37.59mm) | - | Bolt On and PC Pin | TO-220 (Dual) | 0.500" (12.70mm) | 2.0W @ 30°C | 3.00°C/W @ 700 LFM | ||||
TE Connectivity AMP Connectors |
45
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA 21MM 3FIN RADIAL
|
- | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.467" (11.86mm) | - | 6.00°C/W @ 200 LFM | ||||
TE Connectivity AMP Connectors |
Inquiry
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-
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MOQ: 1 MPQ: 1
|
HEAT SINK BGA 21MM 3FIN RADIAL
|
- | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.442" (11.23mm) | - | 6.00°C/W @ 200 LFM |