- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
Advanced Thermal Solutions Inc. |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB BLACK
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Board Level, Vertical | Rectangular, Fins | Bolt On and PC Pin | - | 9.50°C/W @ 200 LFM | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | Rectangular, Fins | Bolt On | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | ||
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Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
Board Level, Vertical | Rectangular, Angled Fins | Bolt On and Board Mounts | - | 9.90°C/W @ 200 LFM | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | Bolt On and Board Locks | 1.5W @ 40°C | 10.00°C/W @ 200 LFM |
