- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
6,675
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO220 HOR MNT W/TAB.75"
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Board Level | Rectangular, Fins | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 1.5W @ 40°C | 8.00°C/W @ 500 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular | 2.0W @ 50°C | 8.00°C/W @ 500 LFM |
