- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | |
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Aavid, Thermal Division of Boyd Corporation |
2,809
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLK
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Board Level | Rectangular, Fins | Clip | 1.5W @ 40°C | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | Clip and PC Pin | 1.5W @ 40°C | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular | Clip and PC Pin | 2.0W @ 50°C |
