- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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Discover 5 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Aavid, Thermal Division of Boyd Corporation |
2,809
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLK
|
Board Level | Rectangular, Fins | Clip | 1.5W @ 40°C | 8.00°C/W @ 500 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
6,675
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 HOR MNT W/TAB.75"
|
Board Level | Rectangular, Fins | Clip and PC Pin | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Rectangular, Fins | Clip | 3.0W @ 60°C | 6.00°C/W @ 600 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | Clip and PC Pin | 1.5W @ 40°C | 8.00°C/W @ 500 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular | Clip and PC Pin | 2.0W @ 50°C | 8.00°C/W @ 500 LFM |