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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
6,156
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SM FOOTPRINT BLK
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272 | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | - | Bolt On and PC Pin | TO-220, TO-202 | 0.375" (9.52mm) | 4.0W @ 42°C | 3.60°C/W @ 400 LFM | ||
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TE Connectivity AMP Connectors |
357
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BGA 25MM 7FIN RADIAL
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- | - | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.894" (22.71mm) | - | 3.80°C/W @ 200 LFM |
