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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Rectangular, Fins | 0.602" (15.29mm) | - | - | TO-92 | 1.220" (31.00mm) | 0.5W @ 20°C | 20.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Rectangular, Fins | 0.406" (10.31mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | TO-5 | 0.395" (10.03mm) | 1.0W @ 40°C | 35.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Cylindrical | - | - | 0.315" (8.00mm) ID, 0.875" (22.23mm) OD | TO-5 | 0.531" (13.49mm) | 1.0W @ 50°C | 30.00°C/W @ 200 LFM |