- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
7,556
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-92 .72" BLK
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Board Level, Vertical | Rectangular, Fins | 0.602" (15.29mm) | - | - | Press Fit | TO-92 | 0.720" (18.29mm) | 0.3W @ 20°C | 17.50°C/W @ 400 LFM | Black Anodized | ||
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ASSMANN WSW Components |
1,993
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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Board Level | Rectangular, Fins | 0.984" (25.00mm) | 0.472" (12.00mm) | - | Bolt On | TO-220 | 0.177" (4.50mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
421
|
3 days |
-
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MOQ: 1 MPQ: 1
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TO-5 PUSH-ON HEATSINK 6.35MM
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Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | Black Anodized | ||
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ASSMANN WSW Components |
25
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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Board Level | Rectangular, Fins | 0.984" (25.00mm) | 0.472" (12.00mm) | - | Bolt On | TO-220 | 0.177" (4.50mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Rectangular, Fins | 0.750" (19.05mm) | 0.604" (15.34mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.212" (5.39mm) | 0.6W @ 40°C | 60.00°C/W @ 100 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | Red Anodized |
