- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
761
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3 days |
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .515"TO-220
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Board Level, Vertical | Clip and PC Pin | 10.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
976
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 21MM
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Board Level | Clip and Board Locks | 8.00°C/W @ 400 LFM |
