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- Width：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
1,707
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 .750" COMPACT
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Board Level | Rhombus | 1.880" (47.75mm) | 1.400" (35.56mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 4.0W @ 40°C | 3.00°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
6,716
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TABS 1.67"HIGH
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Board Level, Vertical | Rectangular, Fins | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BGA HEAT SINK
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Top Mount | Square, Fins | 0.985" (25.02mm) | 0.985" (25.02mm) | Thermal Tape, Adhesive (Included) | BGA | 0.390" (9.91mm) | - | 5.30°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 1.774" (45.06mm) | 1.378" (35.00mm) | Bolt On and PC Pin | TO-220 | 0.512" (13.00mm) | 3.0W @ 40°C | 4.00°C/W @ 400 LFM |
