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Discover 17 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
3,250
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
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Wakefield-Vette |
547
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 EPOXY INSUL BLK
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260 | Board Level | Beryllium Copper | Cylindrical | 0.370" (9.40mm) | 0.380" (9.65mm) | 0.290" (7.37mm) ID | Bolt On | TO-5 | - | - | - | Black Ebonol | ||
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ASSMANN WSW Components |
1,179
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
2,270
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.185" (55.50mm) | 1.378" (35.00mm) | - | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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Ohmite |
499
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3 days |
-
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MOQ: 1 MPQ: 1
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BLACK ANODIZED HEATSINK
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EX | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | Bolt On and Board Mounts | TO-247 | 1.500" (38.10mm) | 4.0W @ 70°C | 4.00°C/W @ 300 LFM | Black Anodized | ||
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ASSMANN WSW Components |
294
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
406
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TOP-3 TO-220 SOT-32
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
838
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.185" (55.50mm) | 1.378" (35.00mm) | - | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | - | Tin | ||
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Ohmite |
302
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3 days |
-
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MOQ: 1 MPQ: 1
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BLACK ANODIZED HEATSINK
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EX | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | Bolt On and Board Mounts | TO-220 | 1.500" (38.10mm) | 3.0W @ 50°C | 5.00°C/W @ 200 LFM | Black Anodized | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK VERT ALUM BLK TO-220
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206 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 4.0W @ 56°C | 7.30°C/W @ 200 LFM | Black Anodized | |||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK VERT ALUM BLACK TO-220
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265 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 4.0W @ 56°C | 7.00°C/W @ 200 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Top Mount | - | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CUP CLIP TRANSISTOR C3488 REV H
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260 | Board Level | Beryllium Copper | Cylindrical | 0.400" (10.16mm) | 0.370" (9.40mm) | 0.290" (7.37mm) ID | Bolt On | TO-5 | - | - | - | Black Ebonol | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK FOR TO-5 PKG
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260 | Board Level | Beryllium Copper | Cylindrical | 0.557" (14.15mm) | 0.370" (9.40mm) | 0.290" (7.37mm) ID | Bolt On | TO-5 | - | - | - | Black Ebonol | ||
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CTS Thermal Management Products |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW PROFILE BLK TO-220
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7 | Board Level | Aluminum | Rectangular, Fins | 0.682" (17.32mm) | 1.750" (44.45mm) | - | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 3.0W @ 40°C | - | Black Anodized |
