- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
3,006
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK W/TAB BLACK
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Board Level, Vertical | Clip and PC Pin | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Clip | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON W/TABS
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Board Level, Vertical | Clip and Board Locks | 2.0W @ 30°C | 5.00°C/W @ 200 LFM |
