- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
Discover 2 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,006
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK W/TAB BLACK
|
Board Level, Vertical | Clip and PC Pin | 2.0W @ 30°C | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Clip | 3.0W @ 40°C |
