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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | 0.900" (22.86mm) | 1.000" (25.40mm) | Bolt On | 0.380" (9.65mm) | 2.0W @ 40°C | 4.00°C/W @ 700 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | 0.848" (21.55mm) | 0.900" (22.86mm) | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | Copper | 0.700" (17.78mm) | 0.900" (22.86mm) | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | Tin |
