- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
1,014
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON/TAB
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Board Level, Vertical | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
1,742
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK CLIP-ON
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Board Level | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip | TO-220 | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | 0.850" (21.59mm) | 1.000" (25.40mm) | Clip | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 0.850" (21.59mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM |
