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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Ohmite |
93
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK BLACK ANODIZED
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CSM | Board Level, Vertical | Aluminum | 1.575" (40.00mm) | 0.492" (12.50mm) | Solderable Feet | 1.228" (31.20mm) | 6.0W @ 65°C | - | ||
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 35
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HSE | Board Level | Aluminum Alloy | 1.378" (35.00mm) | 1.142" (29.00mm) | Bolt On | 0.472" (12.00mm) | 6.2W @ 75°C | 2.91°C/W @ 200 LFM |
