Series:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
ATS-EXL69-300-R0
Advanced Thermal Solutions Inc.
20
3 days
-
MOQ: 1  MPQ: 1
HEATSINK AL6063 300X36.28MM
- Top Mount 11.800" (299.72mm) 1.417" (36.00mm) Adhesive - 1.102" (28.00mm) - 5.40°C/W @ 200 LFM Degreased
CSM221-40AE
Ohmite
93
3 days
-
MOQ: 1  MPQ: 1
HEATSINK BLACK ANODIZED
CSM Board Level, Vertical 1.575" (40.00mm) 0.492" (12.50mm) Solderable Feet TO-220 1.228" (31.20mm) 6.0W @ 65°C - Black Anodized