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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 22 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Apex Microtechnology |
688
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO3
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Board Level | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 7.0W @ 80°C | 14.00°C/W @ 200 LFM | 11.70°C/W | ||
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Apex Microtechnology |
422
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TOP MT TO-3
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Top Mount | Rhombus | 1.600" (40.64mm) | 1.000" (25.40mm) | Bolt On | TO-3 | 1.000" (25.40mm) | 1.5W @ 20°C | 2.00°C/W @ 600 LFM | 11.60°C/W | ||
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Apex Microtechnology |
381
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 4.5C/W
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Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.500" (38.10mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 4.50°C/W | ||
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Apex Microtechnology |
87
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO3
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Board Level | Rectangular, Fins | 5.421" (139.70mm) | 4.812" (122.22mm) | Bolt On | TO-3 | 1.310" (33.27mm) | - | 0.40°C/W @ 800 LFM | 1.48°C/W | ||
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Apex Microtechnology |
48
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 1.7C/W
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Board Level | Rectangular, Fins | 3.000" (76.20mm) | 4.812" (122.22mm) | Bolt On | TO-3 | 1.310" (33.27mm) | - | 1.00°C/W @ 200 LFM | 2.00°C/W | ||
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Apex Microtechnology |
31
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 12P DIP
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Board Level | Rectangular, Fins | 5.421" (139.70mm) | 4.612" (117.14mm) | Bolt On | PDIP | 1.500" (38.10mm) | - | - | 1.00°C/W | ||
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Apex Microtechnology |
100
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 12P PWR SIP
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Board Level | Rectangular, Fins | 3.000" (76.20mm) | 2.360" (59.94mm) | Bolt On and PC Pin | PSIP | 0.630" (16.00mm) | - | - | 5.30°C/W | ||
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Apex Microtechnology |
34
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 1.7C/W
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Board Level | Rectangular, Fins | 3.000" (76.20mm) | 4.750" (120.65mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 15.0W @ 30°C | 1.00°C/W @ 200 LFM | 1.70°C/W | ||
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Apex Microtechnology |
9
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 12P DIP .6C/W
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Board Level | Rectangular, Fins | 5.421" (139.70mm) | 6.250" (158.75mm) | Bolt On | PDIP | 2.000" (50.80mm) | - | 0.30°C/W @ 600 LFM | 0.96°C/W | ||
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Apex Microtechnology |
11
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK OPEN FRAME 0.5C/W
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Board Level | Rectangular, Fins | 9.000" (228.60mm) | 6.620" (168.15mm) | Bolt On | - | 1.780" (45.21mm) | - | - | 0.50°C/W | ||
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Apex Microtechnology |
9
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 .95C/W
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Board Level | Rectangular, Fins | 3.000" (76.20mm) | 4.750" (120.65mm) | Bolt On | TO-3 | 3.000" (76.20mm) | 50.0W @ 60°C | 0.35°C/W @ 300 LFM | 0.95°C/W | ||
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Apex Microtechnology |
6
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 12P TO220 2.7C/W
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Board Level | Rectangular, Fins | 5.906" (150.00mm) | 1.770" (44.96mm) | Clip | TO-220 | 1.181" (30.00mm) | - | - | 2.70°C/W | ||
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Apex Microtechnology |
4
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 10P DIP
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Board Level | Rectangular, Fins | 3.000" (76.20mm) | 4.812" (122.22mm) | Bolt On | 10-PowerDip | 1.310" (33.27mm) | - | 0.60°C/W @ 600 LFM | 2.00°C/W | ||
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Apex Microtechnology |
7
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 15W
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Board Level | Rectangular, Fins | 4.750" (120.65mm) | 5.421" (139.70mm) | Bolt On | TO-3 | 2.630" (66.80mm) | 20.0W @ 20°C | 0.30°C/W @ 500 LFM | 0.85°C/W | ||
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Apex Microtechnology |
4
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK OPEN FRAME
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Board Level | Rectangular, Fins | 5.421" (139.70mm) | 4.812" (122.22mm) | Bolt On | - | 1.310" (33.27mm) | - | 0.40°C/W @ 800 LFM | 1.46°C/W | ||
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Apex Microtechnology |
15
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 10P/12P PWR SIP
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Board Level | Rectangular, Fins | 3.500" (88.90mm) | 5.350" (135.89mm) | Bolt On | - | 2.276" (57.81mm) | - | - | 1.30°C/W | ||
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Apex Microtechnology |
5
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 2TO-3 & 12P DIP H2O
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Board Level | Rectangular, Fins | 6.000" (152.40mm) | 8.000" (203.00mm) | Bolt On | TO-3, PDIP | 2.000" (50.80mm) | - | - | 0.68°C/W | ||
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Apex Microtechnology |
5
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK WAKEFIELD 232-200AB
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Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | 10.00°C/W | ||
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Apex Microtechnology |
2
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 6P DIP
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Board Level | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | Bolt On | 6-DIP | 0.900" (22.86mm) | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | 5.60°C/W | ||
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Apex Microtechnology |
10
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SIP
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Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | Bolt On and PC Pin | - | 1.000" (25.40mm) | - | - | - |
