- Type：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
1,950
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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CUI Inc. |
2,094
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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|
|
CUI Inc. |
2,094
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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Top Mount | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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Top Mount | 0.590" (14.99mm) | 1.020" (25.91mm) | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W |
