- Manufacturer：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
1,389
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK BLK ANOD ALUM TO-220
|
Board Level | Press Fit | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | ||
|
|
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ASSMANN WSW Components |
1,630
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM WITH PIN TO-220
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Board Level | PC Pin | - | - | 16.00°C/W | ||
|
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CUI Inc. |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level, Vertical | PC Pin | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
|
|
|
CUI Inc. |
360
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level | - | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
|
|
|
ASSMANN WSW Components |
64
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
Board Level, Vertical | PC Pin | - | - | 16.00°C/W | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level | PC Pin | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W |
