- Manufacturer:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 33 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Advanced Thermal Solutions Inc. |
1,372
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 31X31X14.5MM
|
fanSINK, maxiGRIP | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 2.10°C/W @ 200 LFM | - | ||||
Aavid, Thermal Division of Boyd Corporation |
3,006
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK W/TAB BLACK
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | Clip and PC Pin | Multiwatt, SIP | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | 11.50°C/W | ||||
Advanced Thermal Solutions Inc. |
572
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 24.5MM
|
- | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 4.00°C/W @ 200 LFM | - | ||||
Wakefield-Vette |
243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X12MM ELLIPTICAL
|
906 | Top Mount | Square, Fins | 1.220" (30.99mm) | Clip | BGA | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | 10.70°C/W | ||||
Wakefield-Vette |
155
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X23MM PIN
|
906 | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.40°C/W @ 200 LFM | 9.90°C/W | ||||
Wakefield-Vette |
339
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X23MM ELLIPTICAL
|
906 | Top Mount | Square, Fins | 1.220" (30.99mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.50°C/W @ 200 LFM | 8.90°C/W | ||||
Advanced Thermal Solutions Inc. |
228
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 3.20°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
155
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
maxiGRIP | Top Mount | Square, Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 12.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 14.5MM
|
maxiGRIP | Top Mount | Square, Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 6.20°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
575
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
- | Top Mount | Square, Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 12.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
1,779
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
- | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 13.50°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
202
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 14.5MM
|
- | Top Mount | Square, Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 6.20°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
915
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 14.5MM
|
- | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 7.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
432
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 19.5MM
|
- | Top Mount | Square, Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 4.70°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
845
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 24.5MM
|
- | Top Mount | Square, Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 3.60°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
258
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 7.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
821
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 19.5MM
|
maxiGRIP | Top Mount | Square, Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 4.70°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
1,482
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 14.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 4.20°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 31X31X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 2.90°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 31X31X19.5MM
|
fanSINK, maxiGRIP | Top Mount | Square, Pin Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 1.90°C/W @ 200 LFM | - |